e3511 Wafer Ashing System
Applications
  • Bulk Resist, Post LDI Resist Strip, Polymer Removal

  • Descum processing

  • Surface treatment for better Dep Adhesion

  • Post high dose implant strip

  • Oxidation

  • Isotropic etch

  • MEMS Applications

General Information
  • Substrate sizes 100-200 mm

  • Tool Footprint 30” (762 mm) W x 38” (965mm) D x 58” (1473mm) H

  • Photoresist strip Typical Throughput 60 WPH

  • Ash Rates < 200Å - ≥3.5. μm./min.

  • Uniformity Within Wafer 2% - 5%

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Features
  • True downstream Microwave plasma process ( 24” from the product)

  • Fully compatible Process and Chamber with the Gasonics L3510

  • Platen Temp enhanced range from 60 to 350 Deg

  • Enhanced IDX Flexware® Software Control 

  • Embedded Intel® i7 multi-core PC with Slice I/O modules

  • Ethernet Smart Controls for Pressure control, Robot
    and Gas flow controls ( MFC’s)

  • Flash drive data storage & USB Backup for recipes/data

  • SECS/GEM Compliant, HSMS Standard

  • Easy-to-Use, Configurable Display

  • Easy to see 17” touchscreen

  • Built-in watchdog timer for safe operation

  • LED status of power and Digital I/O

  • Solid State Controls for Lamp and Platen Heater

  • New Hatm-5 pick and place robot

  • 1.2kw MicroWave power

  • Lamp assisted processing for better uniformity and enhanced ash rates

Asher Semiconductor ESI
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