e3511 Wafer Ashing System
Applications
-
Bulk Resist, Post LDI Resist Strip, Polymer Removal
-
Descum processing
-
Surface treatment for better Dep Adhesion
-
Post high dose implant strip
-
Oxidation
-
Isotropic etch
-
MEMS Applications
General Information
-
Substrate sizes 100-200 mm
-
Tool Footprint 30” (762 mm) W x 38” (965mm) D x 58” (1473mm) H
-
Photoresist strip Typical Throughput 60 WPH
-
Ash Rates < 200Å - ≥3.5. μm./min.
-
Uniformity Within Wafer 2% - 5%
Features
-
True downstream Microwave plasma process ( 24” from the product)
-
Fully compatible Process and Chamber with the Gasonics L3510
-
Platen Temp enhanced range from 60 to 350 Deg
-
Enhanced IDX Flexware® Software Control
-
Embedded Intel® i7 multi-core PC with Slice I/O modules
-
Ethernet Smart Controls for Pressure control, Robot
and Gas flow controls ( MFC’s) -
Flash drive data storage & USB Backup for recipes/data
-
SECS/GEM Compliant, HSMS Standard
-
Easy-to-Use, Configurable Display
-
Easy to see 17” touchscreen
-
Built-in watchdog timer for safe operation
-
LED status of power and Digital I/O
-
Solid State Controls for Lamp and Platen Heater
-
New Hatm-5 pick and place robot
-
1.2kw MicroWave power
-
Lamp assisted processing for better uniformity and enhanced ash rates
